Micro Electronics
Mission-Critical Microelectronics, Engineered for Excellence
At Centum Electronics, we design and manufacture high-reliability Microelectronics and Hybrid Micro Circuits tailored for aerospace, defense, and high-performance industrial applications. With an ISRO-qualified facility and decades of expertise, our Micro Electronics division delivers precision, performance, and proven quality for the most demanding environments.
Our Strengths
Core Capabilities
Thick and Thin Film Microelectronics
Our thick and thin film technologies allow us to create miniaturized, high-density, and thermally efficient circuit assemblies.
Substrate Materials
-
Alumina (96%)
-
Beryllia (BeO)
-
Aluminium Nitride (AlN)
-
LTCC, RT Duroid, TMM10i
Conductors
-
Gold (Au)
-
Silver (Ag)
-
PtAg
-
PdAg
-
PtPdAg
Resistor Range
0.1 ohm/sq
1 Mohm/sqx c
Static and dynamic trimming using Nd:YAG laser with 0.1% trimming accuracy
Printing Capabilities
Die & Substrate Assembly
We support a wide range of die and substrate combinations to meet the electrical and thermal performance required by advanced systems.
-
Die Size:
20 mil x 20 mil to 500 mil x 500 mil -
Die Types:
Silicon (Si), Gallium Arsenide (GaAs), Gallium Nitride (GaN) -
Substrates:
Alumina, BeO, AlN, LTCC, Duroid, TMM10i -
High-Power Combo Film Attachments:
for optimal thermal and electrical conductivity -
Die Shear Strength Testing:
as per MIL-STD-883, Method 2019
Wire & Ribbon Bonding
We offer comprehensive bonding solutions for high-reliability assemblies:
Bonding Techniques
-
Thermo-sonic ball-wedge bonding
-
Wedge-wedge bonding
-
Ribbon bonding
Bonding Materials
-
Gold: 0.7 mil to 2 mil (wire), 1 mil x 5–20 mil / 2 mil x 12 mil (ribbon)
-
Aluminum: 0.7 to 20 mil
Surface Preparation
-
Vapor degreasing
-
Plasma cleaning (Argon & Oxygen)
Testing & Validation
-
Wire pull tests (manual/semi-automatic)
-
Non-destructive and destructive bond pull tests (MIL-STD-883, Methods 2023 & 2011)
Hermetic Sealing & Leak Testing
To ensure longevity and reliability in harsh environments, we perform Fine & Gross Leak Tests In compliance with MIL-STD-883, Method 1014
Specialized Product Categories
Why Centum?
-
• End-to-end microelectronic solutions under one roof
-
• Flight-proven components and assemblies for aerospace & defense
-
• High-mix, low-to-medium volume manufacturing expertise
-
• Strong quality assurance culture with traceability and compliance
